Process Integration and Yield Technician
Intel · US, Arizona, Phoenix
Est. total comp~$110K–$157KFrom the posting
Job Details:
Job Description: We are part of the assembly and test technology development team based in Chandler, supporting advanced electronic packaging technology development. Our team directly supports quality and reliability failure analysis and also supports package material and assembly process development. The candidate will be responsible for conducting failure analysis to identify electrical failures, as well as physical failure analysis to support root cause understanding of new package technologies. Require setting up, operating and maintaining laboratory instruments, conducting experiments, making observations and documenting results, and often developing conclusions. Note: The work schedule will be 10x4 (10hr per day, Sunday – Wednesday or Wednesday – Saturday).
Candidate should exhibit the following behavioral traits: • Verbal and technical writing skills. • Work well with a team, deliver under pressure, and well organized.
Qualifications: You must possess the below minimum qualifications to be initially considered for this position. Preferred qualifications are in addition to the requirements and are considered a plus factor in identifying top candidates.
Minimum Qualifications: • Candidate must possess an Associate degree or Bachelor's degree in Material Science Engineering, Electrical Engineering, Chemical Engineering, Mechanical Engineering or related fields of study. …
Job inventory
Required 2 items
1y
Education: Bachelor's degree
Experience: 1+ year of experience
Preferred none listed in the text we have
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